Because of its environmental protection and energy saving advantage of LED lighting industry got rapid development, but also for the development of the aluminum plate injected powerful propulsion, the mass traditional PCB manufacturer, family small workshops, and some of the ceramic substrate manufacturers, are in the market LED aluminum plate, chaos caused the industry development, LED aluminum plate appear product quality is uneven.
Aluminum substrate is one of the important components of LED lighting products, which is very important for the development of LED industry.
Relevant national departments have stepped up the development of LED lighting industry standards, aluminum substrate industry in the domestic low-cost access to the market era is coming to an end.
If the comprehensive performance of LED aluminum substrate is not improved as soon as possible, it will be replaced by other new materials and risk losing the market.
Heat is the enemy of other silicon semiconductors and leds.
With the continuous development of LED industry, the product volume will be smaller and smaller, and the power density will be larger and larger. How to find the best method of structure and heat dissipation design has become a problem that has to be solved in the design of LED products. The use of LED aluminum substrate with high thermal conductivity is undoubtedly one of the most effective means to solve the heat dissipation problem.
LED aluminum substrate is a heat dissipation function of metal base copper (MCPCB), it is composed of circuit layer (copper foil), thermal insulation layer and metal base layer structure.
The heat dissipation principle of LED aluminum substrate: the surface of LED power device is mounted in the circuit layer, and the heat generated in the operation is conducted from the insulation layer to the metal substrate, and then through the thermal interface material to the radiator, so that most of the heat generated by the LED has been diffused to the surrounding air by convection.
The circuit layer of LED aluminum substrate (generally using electrolytic copper foil) is etched to form printed circuit, which is used to realize the connection and assembly between devices.
Compared with traditional fr-4, LED aluminum substrate carries higher current.
Thermal insulation layer is the core technology of aluminum substrate, which mainly plays the role of heat conduction, bonding and insulation.
Most of the traditional insulation layer USES fr-4 semi-cured sheet (thermal conductivity is only 0.3W/m?
K), without the addition of other thermal conductivity filler, the thermal conductivity is also poor.
The LED aluminum substrate insulation layer is composed of a polymer (mainly epoxy resin) filled with ceramic powder, which has good thermal conductivity (thermal conductivity up to 2.2w /m?).
K), high insulation strength and adhesion performance.
In the pursuit of better performance, the choice of heat dissipation substrate material has been constantly changing, from the copper substrate to aluminum substrate, and then to the enterprise used composite substrate, ceramic substrate, and then back to metal materials.
Considering the technical and cost conditions, aluminum plate is an ideal material for metal base.
Some people in the LED industry believe that silicon steel, iron, stainless steel, copper and other materials can be used under the requirements of higher mechanical properties, electrical properties, heat conduction properties and other special properties.